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SLN receives National Award from Government of India for R&D for the year 2008
 
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PCB Equipment (for Prototyping) Galvanic Plating Machine
 


Manufacturer: Bungard Elektronik, Germany
Galvanic Plating Machine

Professional equipment for laboratory prototyping of through-hole plated PCBs up to 210 x 300 mm size. Clean system including built-in rinsing compartment. Maintenance free and made for easy processing and handling. This particular machine type is optimized in terms of space requirements and costs. Compacta L 30 is suitable for the Dexter 3 D process (known on the market as the ABC chemical system). Bigger and customized units are also available (see our web site for COMPACTA L 400).

Features

  • Processing sequence for the ABC panel plating (tenting) technique:
    • Cleaner
    • Conditioner
    • Pre-dip
    • Catalyst
    • Salt remover
    • Copper plate

  • Equipment:
    • 5 treatment tanks, 2 of them with heaters
    • 1 galvanic copper bath
    • 1 triple-cascade rinse with flow control
    • 1 spray rinse tank with magnetic valve, foot switch and flow control
    • 1 free tank (i.e. for chemical tinning)

  • Rectifier:
    • 1 Rectifier for copper plating 6 V / 40 A, separate current and voltage display and setting. Residual ripple < 0.1 % DCU

  • Bath control:
    • 2 PTFE/PFA coated heaters, controlled by analogue instruments, full digital timers with count-down, auto-reset and beeper. Air injection into the copper plating bath. Board movement by DC gear motor, adjustable speed

Technical Data


Tank Dimensions Treatment Tanks Galvanic Copper Tank
Length 400 mm 400 mm
Width 100 mm 275 mm
Depth 300 mm 300 mm
Capacity 10 l ca. 30 l

Total size (W x D x H) 88 cm x 100 cm x 135 cm
Working level 95 cm
Weight approx. 80 kg
Heaters 2 x 400 W
Rectifier 1 x 6 V, 40 A
Power supply 220 V, 50 Hz, 6.3 A
RFQ


 

 
 
 
 
 
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