CNC Double Column Drilling

• For handling and exposing delicate solder resist for high density, fine pattern applications.
• Capable of exposing not only liquid solder resist but also liquid pattern resist and photo via build up.
• High intensity models available with 8KW (HAP8020SR) short arc mercury lamps.

PANEL and PATTERN as well as automatic panel loading and collecting devices.For processing thin panels and panels with tiny holes, PAT takes special measures to do the loading and bubble removal in order to improve yields.

An even or no trace matte finish appeared by the abrasive spray is the best condition of the panel surface for the pre-treatment of D/F lamination, solder mask and liquid photo resist.

Maskless, Beam – overlapping method. Applicable to next generation PWB processes

Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure