FTG offers the widest range of products and services in the Printed Circuit Board Industry. High Layer counts, HDI Technology, Controlled and Reliable Process Technology in a QTA through medium volume environment.
Product Offering
- Engineering Services:
- DFM review & net list compare
- mpedance calculations & stackup review
- BGA channel routing (licensed)
- Microvia technology (YAG laser)
- Buried capacitance (licensed)
- Blind & buried via’s
- Multilayer boards up to 44 layers
- Conductive filled vias (CB100)
- Custom milling (edge and internal)
- Cavity boards
- Metal core constructions (CMC, CIC, copper, aluminum)
- Multiple sequential laminations
- Tented, filled and flush plugged via’s
- Differential and controlled impedance
- Embedded filters and inductors
- Design assistance and 3D modeling
- Mixed dielectric (hybrid) boards
- Controlled depth drilling
- Buried resistor layers
- Performance testing
- Back Drilling
- Back Planes
Materials
High Tg FR4
- Isola
- Nelco
- Matsushita High Speed
- Isola IS620
- Nelco 4000/13 and (SI)
- G Tek
- Matsushita Megtron
- Isola IS408
- Rogers 4003 and 4350 Specialty Substrates
- Polyimide
- BT Resin
- Arlon 25N, 45N, CLTE, NK46
- Thermagon
- Berquist
- Thermount
- TMM 10 and 10.1
- Teflon/Duroid – 3000 and 6000 series
- Heat Sink fabrication and lamination (both alodined and anodized finish)
- Copper invar copper
- Copper moly copper
- CAF resistant
Flexible circuits
Rigid flex circuits Surface Finishes
- Hot air solder leveling (HASL)
- Hot oil fuse
- Electrolytic nickel/gold
- Electroless nickel/gold (ENIG)
- Immersion silver
- Immersion white tin
- OSP (Entek 106A)
- Soft wire bondable gold
- Hard gold
- Nickel/Palladiium/gold
- Fused tin lead
- TAB gold Solder Mask
- Taiyo PSR4000BN
- Enthone DSR 3241 and 3300 BR
- Conformask dry film
- Dupont Vacrel dry film
- Dynamask Qualifications
- MIL-PRF-55110
- ISO-9001:2000
- AS9100B
- Bellcore TWR-000078 compliant
- UL recognized 94V-0
- Marshall Space Flight Center (NASA)
- ANSI/ISO/ASQ Q9001-2000
- MIL-PRF-31032
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