Reference Hole Drilling

The newly developed image Processing Technology gives highly reliable detection of OPEN, SHORT, CONTAMINATION, STAIN, SCRATCH, and DISCOLORATION on PCBs. Miss-Detection by Over Care is minimized. The most suitable for inspection on High Density Board such as COB and BGA,and inspection on solder leveler PCBs

In this process panels are cleaned, flux coated before HAL and then panels are soldered after solder mask process then post cleaning is done.

Hot Air Solder Leveling Systems Lantronic Hot Air Solder Leveling Machines are built to the highest standard. Features of the machines are imple operation and maintenance procedures and there is a model to suit all sizes of manufacturers

Maskless, Beam – overlapping method. Applicable to next generation PWB processes

Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure

COMPACT MULTI LAYER SHEAR/BEVELER WITH OPTICAL ALIGNMENT SYSTEM.