PANEL and PATTERN as well as automatic panel loading and collecting devices.For processing thin panels and panels with tiny holes, PAT takes special measures to do the loading and bubble removal in order to improve yields.
In this process panels are cleaned, flux coated before HAL and then panels are soldered after solder mask process then post cleaning is done.
Hot Air Solder Leveling Systems Lantronic Hot Air Solder Leveling Machines are built to the highest standard. Features of the machines are imple operation and maintenance procedures and there is a model to suit all sizes of manufacturers
This high performance multilayer press was designed for PCB labs to enable quick prototyping of multilayer PCBs of up to 6 or 8 layers according to industry standards. A compact and floor standing aluminium rack contains all parts of the unit including pressure supply, press plates and heaters.
This line is to form the patterns on the panels by chemical treatment, whose configuration is Developing + Etching + Stripping. Developing and Etching module with our rotary spray system are readily achievable high etching factor to a fine pattern. It can be used a chemical, CuCl2 and FeCl2.\
High precision vacuum exposure unit especially designed for double sided contact exposure of presensitized base materials such as tampon printing clichés, PCBs, front-panels, daylight films and other UV sensitive coatings.
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