Maskless, Beam – overlapping method. Applicable to next generation PWB processes
Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure
Maskless, Beam – overlapping method. Applicable to next generation PWB processes
Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure
Maskless, Beam – overlapping method. Applicable to next generation PWB processes
Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure
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This is meant for excellent surface preparation prior to dry film lamination and / or printing processes.
High precision vacuum exposure unit especially designed for double sided contact exposure of presensitized base materials such as tampon printing clichés, PCBs, front-panels, daylight films and other UV sensitive coatings.
Manufacturer: Hakuto Co. Ltd., Japan Automatic Exposure System(Model : HAP5020)
Technical Data
In this process panels are cleaned, flux coated before HAL and then panels are soldered after solder mask process then post cleaning is done.
Hot Air Solder Leveling Systems Lantronic Hot Air Solder Leveling Machines are built to the highest standard. Features of the machines are imple operation and maintenance procedures and there is a model to suit all sizes of manufacturers
Manufacturer: Kuang Chien Computer Co., Ltd. (Comweb, Taiwan)CNC Double Column Drilling Machine Model No.: CDM-820
Manufacturer: Intelicoat Technologies, USA APF Laminator
Manufacturer: ATMA International Corp., Taiwan.Electric Flat Screen Printer

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