Professional equipment for laboratory prototyping of through-hole plated PCBs up to 210 x 300 mm size. Clean system including built-in rinsing compartment. Maintenance free and made for easy processing and handling. This particular machine type is optimized in terms of space requirements and costs. Compacta L 30 is suitable for the Dexter 3 D process (known on the market as the ABC chemical system). Bigger and customized units are also available (see our web site for COMPACTA L 400).
In this process panels are cleaned, flux coated before HAL and then panels are soldered after solder mask process then post cleaning is done.
Hot Air Solder Leveling Systems Lantronic Hot Air Solder Leveling Machines are built to the highest standard. Features of the machines are imple operation and maintenance procedures and there is a model to suit all sizes of manufacturers
It supplies a series of PCB wet-process equipment ranging Desmear/PTH, as well as automatic panel loading and collecting devices.For processing thin panels and panels with tiny holes, PAT takes special measures to do the loading and bubble removal in order to improve yields.
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