Manufacturer: GLUNZ & ZENSEN, Switzerland Multiline PRO
Manufacturer: GLUNZ & ZENSEN, Switzerland Multiline PRO
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In this process panels are cleaned, flux coated before HAL and then panels are soldered after solder mask process then post cleaning is done.
Hot Air Solder Leveling Systems Lantronic Hot Air Solder Leveling Machines are built to the highest standard. Features of the machines are imple operation and maintenance procedures and there is a model to suit all sizes of manufacturers
This is meant for excellent surface preparation prior to dry film lamination and / or printing processes.
Features
- Bench top machine, wet processing
- Single side action
- Aluminium, PVC, Stainless Steel construction
- Transport top lid with security switch
- Working width 300 mm
- Board thickness 0.3 – 3 mm
- Conveyor speed 0.2 – 2 m/min
- Adjustable brushing pressure and oscillation speed
- Oscillation length 10 mm
- Mechanical drying by squeezing rollers
- Additional built-in hot air dryer
Technical Data
| Power supply | 230 V~, 50 Hz, 2300 VA |
| Size (L x W x H) | 750 x 590 x 415 mm |
| Usable width | 300 mm |
| Water consumption | approx. 7 7/min |
| Weight | 80 kg |
Manufacturer: Hitachi, Japan CNC Drilling Machine
COMPACT MULTI LAYER SHEAR/BEVELER WITH OPTICAL ALIGNMENT SYSTEM.
Manufacturer: Kuang Chien Computer Co., Ltd. (Comweb, Taiwan)Auto Guide Hole Punching Machine
- For handling and exposing delicate solder resist for high density, fine pattern applications.
- Capable of exposing not only liquid solder resist but also liquid pattern resist and photo via build up.
- High intensity models available with 8KW (HAP8020SR) short arc mercury lamps.
This line is to form the patterns on the panels by chemical treatment, whose configuration is Developing + Etching + Stripping. Developing and Etching module with our rotary spray system are readily achievable high etching factor to a fine pattern. It can be used a chemical, CuCl2 and FeCl2.\
