Manufacturer: Hakuto Co. Ltd., Japan Automatic Exposure System(Model : HAP5020)
Manufacturer: Hakuto Co. Ltd., Japan Automatic Exposure System(Model : HAP5020)
Be the first to review “Dry Film Exposure” Cancel reply
You must be logged in to post a comment.
related items
It supplies a series of PCB wet-process equipment ranging Desmear/PTH, as well as automatic panel loading and collecting devices.For processing thin panels and panels with tiny holes, PAT takes special measures to do the loading and bubble removal in order to improve yields.
This is meant for excellent surface preparation prior to dry film lamination and / or printing processes.
In this process panels are cleaned, flux coated before HAL and then panels are soldered after solder mask process then post cleaning is done.
Hot Air Solder Leveling Systems Lantronic Hot Air Solder Leveling Machines are built to the highest standard. Features of the machines are imple operation and maintenance procedures and there is a model to suit all sizes of manufacturers
This line is to form the patterns on the panels by chemical treatment, whose configuration is Developing + Etching + Stripping. Developing and Etching module with our rotary spray system are readily achievable high etching factor to a fine pattern. It can be used a chemical, CuCl2 and FeCl2.\
High precision vacuum exposure unit especially designed for double sided contact exposure of presensitized base materials such as tampon printing clichés, PCBs, front-panels, daylight films and other UV sensitive coatings.
Manufacturer: GLUNZ & ZENSEN, Switzerland Multiline PRO
The name IONEX stands for ION Exchanger, which is the very heart of this modern waste water treatment system. In total it consists of a two-stage filtration, two ion-exchange and one PH-leveling units. IONEX is ideally suited for all waste water cleaning processes in modern PCB prototype laboratories.
Manufacturer: Kuang Chien Computer Co., Ltd. (Comweb, Taiwan)CNC Double Column Drilling Machine Model No.: CDM-820


There are no reviews yet.