CNC Printed Wiring Boards Routing Machine
CNC Printed Wiring Boards Routing Machine
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Maskless, Beam – overlapping method. Applicable to next generation PWB processes
Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure
In this process panels are cleaned, flux coated before HAL and then panels are soldered after solder mask process then post cleaning is done.
Hot Air Solder Leveling Systems Lantronic Hot Air Solder Leveling Machines are built to the highest standard. Features of the machines are imple operation and maintenance procedures and there is a model to suit all sizes of manufacturers
- For handling and exposing delicate solder resist for high density, fine pattern applications.
- Capable of exposing not only liquid solder resist but also liquid pattern resist and photo via build up.
- High intensity models available with 8KW (HAP8020SR) short arc mercury lamps.
Manufacturer: GLUNZ & ZENSEN, Switzerland Multiline PRO
This is meant for excellent surface preparation prior to dry film lamination and / or printing processes.
Manufacturer: Kuang Chien Computer Co., Ltd. (Comweb, Taiwan)CNC Double Column Drilling Machine Model No.: CDM-820
Technical Data
- Maximum film size: 400 mm x 320 mm
- Maximum plotting area: 380 x 300 mm
- Resolution X: 8 selections from 508 to 8192 dpi
- Resolution Y: 8000 dpi
- Plotting speed: 10 mm of film width / minute for 1016 dpi
- Source of light: Laser diode 670 nm (red)
- Data input: Gerber (RS 274D, RS 274 X), high resolution BMP
- Photoplotter software, included on CD:
- Gerber viewer; Automatic aperture converter for all known Electronic CAD layout systems
- D-code editing, output preview & print
- Interactive, absolute or relative image positioning, film and drill penalization
- Negative plotting, image mirroring
- Control software for Windows 98 … XP included, USB connection required
- Unit dimensions (LxWxH): 700x350x200 mm
An even or no trace matte finish appeared by the abrasive spray is the best condition of the panel surface for the pre-treatment of D/F lamination, solder mask and liquid photo resist.
Maskless, Beam – overlapping method. Applicable to next generation PWB processes
Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure
In this process panels are cleaned, flux coated before HAL and then panels are soldered after solder mask process then post cleaning is done.
Hot Air Solder Leveling Systems Lantronic Hot Air Solder Leveling Machines are built to the highest standard. Features of the machines are imple operation and maintenance procedures and there is a model to suit all sizes of manufacturers
- For handling and exposing delicate solder resist for high density, fine pattern applications.
- Capable of exposing not only liquid solder resist but also liquid pattern resist and photo via build up.
- High intensity models available with 8KW (HAP8020SR) short arc mercury lamps.
Manufacturer: GLUNZ & ZENSEN, Switzerland Multiline PRO
This is meant for excellent surface preparation prior to dry film lamination and / or printing processes.
Manufacturer: Kuang Chien Computer Co., Ltd. (Comweb, Taiwan)CNC Double Column Drilling Machine Model No.: CDM-820
Technical Data
- Maximum film size: 400 mm x 320 mm
- Maximum plotting area: 380 x 300 mm
- Resolution X: 8 selections from 508 to 8192 dpi
- Resolution Y: 8000 dpi
- Plotting speed: 10 mm of film width / minute for 1016 dpi
- Source of light: Laser diode 670 nm (red)
- Data input: Gerber (RS 274D, RS 274 X), high resolution BMP
- Photoplotter software, included on CD:
- Gerber viewer; Automatic aperture converter for all known Electronic CAD layout systems
- D-code editing, output preview & print
- Interactive, absolute or relative image positioning, film and drill penalization
- Negative plotting, image mirroring
- Control software for Windows 98 … XP included, USB connection required
- Unit dimensions (LxWxH): 700x350x200 mm
An even or no trace matte finish appeared by the abrasive spray is the best condition of the panel surface for the pre-treatment of D/F lamination, solder mask and liquid photo resist.
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