Manufacturer: GLUNZ & ZENSEN, Switzerland Multiline PRO
Manufacturer: GLUNZ & ZENSEN, Switzerland Multiline PRO
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Features
- Cutting width max. 530 mm
- Two knifes made of hardened and ground steel
- Spring loaded built-in clamping unit in the front
- Transparent cover hood for user safety and visual control
- Metric edge scales in the front
- Fully adjustable back stop with metric scale for batch work (0…300 mm)
- Smallest cutting size (front) 45 mm
- Durable full steel construction
- All important parts angular adjustable
- Simple exchange of blades
- Adjustable cutting angle
- Adjustable clearance
Maskless, Beam – overlapping method. Applicable to next generation PWB processes
Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure
COMPACT MULTI LAYER SHEAR/BEVELER WITH OPTICAL ALIGNMENT SYSTEM.
PANEL and PATTERN as well as automatic panel loading and collecting devices.For processing thin panels and panels with tiny holes, PAT takes special measures to do the loading and bubble removal in order to improve yields.
Manufacturer: Hakuto Co. Ltd., JapanLaminator
- For handling and exposing delicate solder resist for high density, fine pattern applications.
- Capable of exposing not only liquid solder resist but also liquid pattern resist and photo via build up.
- High intensity models available with 8KW (HAP8020SR) short arc mercury lamps.
This is meant for excellent surface preparation prior to dry film lamination and / or printing processes.
Professional equipment for laboratory prototyping of through-hole plated PCBs up to 210 x 300 mm size. Clean system including built-in rinsing compartment. Maintenance free and made for easy processing and handling. This particular machine type is optimized in terms of space requirements and costs. Compacta L 30 is suitable for the Dexter 3 D process (known on the market as the ABC chemical system). Bigger and customized units are also available (see our web site for COMPACTA L 400).
