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“Ultra thin PCB, VOP Board and HDI board are too thin to be dealt with humans so there is high risk of defect by human mistake or error.
To reduce this kind of mistake due to handling errors, fully automated system is required which can ensure all the process from loading to unloading is automated.
Full Auto plasma system should be designed by considering characteristics of PCB such as size, handling method, line arrangement etc”
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PANEL and PATTERN as well as automatic panel loading and collecting devices.For processing thin panels and panels with tiny holes, PAT takes special measures to do the loading and bubble removal in order to improve yields.
Manufacturer: First EIE, Switzerland Photo Plotter
This is meant for excellent surface preparation prior to dry film lamination and / or printing processes.
Maskless, Beam – overlapping method. Applicable to next generation PWB processes
Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure
It supplies a series of PCB wet-process equipment ranging Desmear/PTH, as well as automatic panel loading and collecting devices.For processing thin panels and panels with tiny holes, PAT takes special measures to do the loading and bubble removal in order to improve yields.
Manufacturer: Hitachi, JapanPWB Co2 Laser Drilling Machine
Manufacturer: Luther & Maelzer, Germany. Universal Tester
In this process each and every finished PCB’s are tested to detect open / shorts in the circuit.
This tester is the ideal tester for high volume testings. With this machine up to 1200 boards per hour can be tested. It stands out because of its very easy handling and operation through its ergonomically designed user interface. Besides the speed and precision, the ease-of-use was the main achievement for this machine.
This line is to form the patterns on the panels by chemical treatment, whose configuration is Developing + Etching + Stripping. Developing and Etching module with our rotary spray system are readily achievable high etching factor to a fine pattern. It can be used a chemical, CuCl2 and FeCl2.\

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