Art work Lamination

This line is to form the patterns on the panels by chemical treatment, whose configuration is Developing + Etching + Stripping. Developing and Etching module with our rotary spray system are readily achievable high etching factor to a fine pattern. It can be used a chemical, CuCl2 and FeCl2.\

• For handling and exposing delicate solder resist for high density, fine pattern applications.
• Capable of exposing not only liquid solder resist but also liquid pattern resist and photo via build up.
• High intensity models available with 8KW (HAP8020SR) short arc mercury lamps.

Maskless, Beam – overlapping method. Applicable to next generation PWB processes

Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure