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“Ultra thin PCB, VOP Board and HDI board are too thin to be dealt with humans so there is high risk of defect by human mistake or error.
To reduce this kind of mistake due to handling errors, fully automated system is required which can ensure all the process from loading to unloading is automated.
Full Auto plasma system should be designed by considering characteristics of PCB such as size, handling method, line arrangement etc”
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An even or no trace matte finish appeared by the abrasive spray is the best condition of the panel surface for the pre-treatment of D/F lamination, solder mask and liquid photo resist.
This is meant for excellent surface preparation prior to dry film lamination and / or printing processes.
The newly developed image Processing Technology gives highly reliable detection of OPEN, SHORT, CONTAMINATION, STAIN, SCRATCH, and DISCOLORATION on PCBs. Miss-Detection by Over Care is minimized. The most suitable for inspection on High Density Board such as COB and BGA,and inspection on solder leveler PCBs
In this process panels are cleaned, flux coated before HAL and then panels are soldered after solder mask process then post cleaning is done.
Hot Air Solder Leveling Systems Lantronic Hot Air Solder Leveling Machines are built to the highest standard. Features of the machines are imple operation and maintenance procedures and there is a model to suit all sizes of manufacturers
It supplies a series of PCB wet-process equipment ranging Desmear/PTH, as well as automatic panel loading and collecting devices.For processing thin panels and panels with tiny holes, PAT takes special measures to do the loading and bubble removal in order to improve yields.
Manufacturer: Hakuto Co. Ltd., Japan Automatic Exposure System(Model : HAP5020)
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