Solder Mask Exposure

Categories: PCB Equipment (Volume Production), PCB Manufacturing solutions

For handling and exposing delicate solder resist for high density, fine pattern applications.
Capable of exposing not only liquid solder resist but also liquid pattern resist and photo via build up.
High intensity models available with 8KW (HAP8020SR) short arc mercury lamps.

Description
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For handling and exposing delicate solder resist for high density, fine pattern applications.
Capable of exposing not only liquid solder resist but also liquid pattern resist and photo via build up.
High intensity models available with 8KW (HAP8020SR) short arc mercury lamps.

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Technical Data

Maximum film size: 400 mm x 320 mm
Maximum plotting area: 380 x 300 mm
Resolution X: 8 selections from 508 to 8192 dpi
Resolution Y: 8000 dpi
Plotting speed: 10 mm of film width / minute for 1016 dpi
Source of light: Laser diode 670 nm (red)
Data input: Gerber (RS 274D, RS 274 X), high resolution BMP
Photoplotter software, included on CD:
Gerber viewer; Automatic aperture converter for all known Electronic CAD layout systems
D-code editing, output preview & print
Interactive, absolute or relative image positioning, film and drill penalization
Negative plotting, image mirroring
Control software for Windows 98 … XP included, USB connection required
Unit dimensions (LxWxH): 700x350x200 mm

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