Manufacturer: Muraki LTD, Japan
Equipped with X-ray unit, the machine detects the target center coated by copper foil, and drill with the accuracy of 0.0008’‘. The target does not have to be a round mark
Equipped with X-ray unit, the machine detects the target center coated by copper foil, and drill with the accuracy of 0.0008’‘. The target does not have to be a round mark
Manufacturer: Muraki LTD, Japan
Equipped with X-ray unit, the machine detects the target center coated by copper foil, and drill with the accuracy of 0.0008’‘. The target does not have to be a round mark
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This is meant for excellent surface preparation prior to dry film lamination and / or printing processes.
Maskless, Beam – overlapping method. Applicable to next generation PWB processes
Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure
Professional equipment for laboratory prototyping of through-hole plated PCBs up to 210 x 300 mm size. Clean system including built-in rinsing compartment. Maintenance free and made for easy processing and handling. This particular machine type is optimized in terms of space requirements and costs. Compacta L 30 is suitable for the Dexter 3 D process (known on the market as the ABC chemical system). Bigger and customized units are also available (see our web site for COMPACTA L 400).
It supplies a series of PCB wet-process equipment ranging Desmear/PTH, as well as automatic panel loading and collecting devices.For processing thin panels and panels with tiny holes, PAT takes special measures to do the loading and bubble removal in order to improve yields.
Manufacturer: Hakuto Co. Ltd., Japan Automatic Exposure System(Model : HAP5020)
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Features
Manufacturer: Hakuto Co. Ltd., JapanLaminator

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