Digital Direct Exposure

Categories: PCB Equipment (Volume Production), PCB Manufacturing solutions

Maskless, Beam – overlapping method. Applicable to next generation PWB processes

Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure

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Maskless, Beam – overlapping method. Applicable to next generation PWB processes

Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure

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Hot Air Levelling

PCB Equipment (Volume Production), PCB Manufacturing solutions

In this process panels are cleaned, flux coated before HAL and then panels are soldered after solder mask process then post cleaning is done.

Hot Air Solder Leveling Systems Lantronic Hot Air Solder Leveling Machines are built to the highest standard. Features of the machines are imple operation and maintenance procedures and there is a model to suit all sizes of manufacturers

Electrolytic Plating (Pattern Plating)

PCB Equipment (Volume Production), PCB Manufacturing solutions

PANEL and PATTERN as well as automatic panel loading and collecting devices.For processing thin panels and panels with tiny holes, PAT takes special measures to do the loading and bubble removal in order to improve yields.

Solder Mask Exposure

PCB Equipment (Volume Production), PCB Manufacturing solutions

For handling and exposing delicate solder resist for high density, fine pattern applications.
Capable of exposing not only liquid solder resist but also liquid pattern resist and photo via build up.
High intensity models available with 8KW (HAP8020SR) short arc mercury lamps.

Digital Direct Exposure

Digital Direct Exposure

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