Maskless, Beam – overlapping method. Applicable to next generation PWB processes
Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure
Maskless, Beam – overlapping method. Applicable to next generation PWB processes
Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure
Maskless, Beam – overlapping method. Applicable to next generation PWB processes
Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure
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Features
Technical Data
Power supply | 230 V~, 50 Hz, 2300 VA |
Size (L x W x H) | 750 x 590 x 415 mm |
Usable width | 300 mm |
Water consumption | approx. 7 7/min |
Weight | 80 kg |
Manufacturer: GLUNZ & ZENSEN, Switzerland Multiline PRO
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This is meant for excellent surface preparation prior to dry film lamination and / or printing processes.
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