Maskless, Beam – overlapping method. Applicable to next generation PWB processes
Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure
Maskless, Beam – overlapping method. Applicable to next generation PWB processes
Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure
Maskless, Beam – overlapping method. Applicable to next generation PWB processes
Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure
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Manufacturer: Hakuto Co. Ltd., Japan Automatic Exposure System(Model : HAP5020)
Features
Technical Data
Power supply | 230 V~, 50 Hz, 2300 VA |
Size (L x W x H) | 750 x 590 x 415 mm |
Usable width | 300 mm |
Water consumption | approx. 7 7/min |
Weight | 80 kg |
In this process panels are cleaned, flux coated before HAL and then panels are soldered after solder mask process then post cleaning is done.
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It supplies a series of PCB wet-process equipment ranging Desmear/PTH, as well as automatic panel loading and collecting devices.For processing thin panels and panels with tiny holes, PAT takes special measures to do the loading and bubble removal in order to improve yields.
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