Manufacturer: Hakuto Co. Ltd., JapanLaminator
Manufacturer: Hakuto Co. Ltd., JapanLaminator
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Manufacturer: Hitachi, Japan PWB Hole Analyzer / PWB Hole Tester Machine
In this process panels are cleaned, flux coated before HAL and then panels are soldered after solder mask process then post cleaning is done.
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Professional equipment for laboratory prototyping of through-hole plated PCBs up to 210 x 300 mm size. Clean system including built-in rinsing compartment. Maintenance free and made for easy processing and handling. This particular machine type is optimized in terms of space requirements and costs. Compacta L 30 is suitable for the Dexter 3 D process (known on the market as the ABC chemical system). Bigger and customized units are also available (see our web site for COMPACTA L 400).
This line is to form the patterns on the panels by chemical treatment, whose configuration is Developing + Etching + Stripping. Developing and Etching module with our rotary spray system are readily achievable high etching factor to a fine pattern. It can be used a chemical, CuCl2 and FeCl2.\
Features
- Bench top machine, wet processing
- Single side action
- Aluminium, PVC, Stainless Steel construction
- Transport top lid with security switch
- Working width 300 mm
- Board thickness 0.3 – 3 mm
- Conveyor speed 0.2 – 2 m/min
- Adjustable brushing pressure and oscillation speed
- Oscillation length 10 mm
- Mechanical drying by squeezing rollers
- Additional built-in hot air dryer
Technical Data
| Power supply | 230 V~, 50 Hz, 2300 VA |
| Size (L x W x H) | 750 x 590 x 415 mm |
| Usable width | 300 mm |
| Water consumption | approx. 7 7/min |
| Weight | 80 kg |
Manufacturer: GLUNZ & ZENSEN, Switzerland Multiline PRO
Maskless, Beam – overlapping method. Applicable to next generation PWB processes
Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure
COMPACT MULTI LAYER SHEAR/BEVELER WITH OPTICAL ALIGNMENT SYSTEM.
Manufacturer: Hitachi, Japan PWB Hole Analyzer / PWB Hole Tester Machine
In this process panels are cleaned, flux coated before HAL and then panels are soldered after solder mask process then post cleaning is done.
Hot Air Solder Leveling Systems Lantronic Hot Air Solder Leveling Machines are built to the highest standard. Features of the machines are imple operation and maintenance procedures and there is a model to suit all sizes of manufacturers
Professional equipment for laboratory prototyping of through-hole plated PCBs up to 210 x 300 mm size. Clean system including built-in rinsing compartment. Maintenance free and made for easy processing and handling. This particular machine type is optimized in terms of space requirements and costs. Compacta L 30 is suitable for the Dexter 3 D process (known on the market as the ABC chemical system). Bigger and customized units are also available (see our web site for COMPACTA L 400).
This line is to form the patterns on the panels by chemical treatment, whose configuration is Developing + Etching + Stripping. Developing and Etching module with our rotary spray system are readily achievable high etching factor to a fine pattern. It can be used a chemical, CuCl2 and FeCl2.\
Features
- Bench top machine, wet processing
- Single side action
- Aluminium, PVC, Stainless Steel construction
- Transport top lid with security switch
- Working width 300 mm
- Board thickness 0.3 – 3 mm
- Conveyor speed 0.2 – 2 m/min
- Adjustable brushing pressure and oscillation speed
- Oscillation length 10 mm
- Mechanical drying by squeezing rollers
- Additional built-in hot air dryer
Technical Data
| Power supply | 230 V~, 50 Hz, 2300 VA |
| Size (L x W x H) | 750 x 590 x 415 mm |
| Usable width | 300 mm |
| Water consumption | approx. 7 7/min |
| Weight | 80 kg |
Manufacturer: GLUNZ & ZENSEN, Switzerland Multiline PRO
Maskless, Beam – overlapping method. Applicable to next generation PWB processes
Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure
COMPACT MULTI LAYER SHEAR/BEVELER WITH OPTICAL ALIGNMENT SYSTEM.
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