Hi-speed position quality measuring for drill holes

This is meant for excellent surface preparation prior to dry film lamination and / or printing processes.

Maskless, Beam – overlapping method. Applicable to next generation PWB processes

Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure

It supplies a series of PCB wet-process equipment ranging Desmear/PTH, as well as automatic panel loading and collecting devices.For processing thin panels and panels with tiny holes, PAT takes special measures to do the loading and bubble removal in order to improve yields.

Manufacturer: Hakuto Co. Ltd., JapanLaminator