Manufacturer: Muraki LTD, Japan
Model No. MPD – 506
Independent of operator’s skill, the machine detects the target center and drill with the accuracy of 0.0008’‘ . The target does not have to be a round mark
Independent of operator’s skill, the machine detects the target center and drill with the accuracy of 0.0008’‘ . The target does not have to be a round mark
Manufacturer: Muraki LTD, Japan
Model No. MPD – 506
Independent of operator’s skill, the machine detects the target center and drill with the accuracy of 0.0008’‘ . The target does not have to be a round mark
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PANEL and PATTERN as well as automatic panel loading and collecting devices.For processing thin panels and panels with tiny holes, PAT takes special measures to do the loading and bubble removal in order to improve yields.
Manufacturer: Kuang Chien Computer Co., Ltd. (Comweb, Taiwan)Auto Guide Hole Punching Machine
Maskless, Beam – overlapping method. Applicable to next generation PWB processes
Hitachi original high – speed RIP (SRC) and light source provide long – lasting uniform light intensity and are capable of high – precision exposure
Features
Technical Data
Power supply | 230 V~, 50 Hz, 2300 VA |
Size (L x W x H) | 750 x 590 x 415 mm |
Usable width | 300 mm |
Water consumption | approx. 7 7/min |
Weight | 80 kg |
Features
Professional equipment for laboratory prototyping of through-hole plated PCBs up to 210 x 300 mm size. Clean system including built-in rinsing compartment. Maintenance free and made for easy processing and handling. This particular machine type is optimized in terms of space requirements and costs. Compacta L 30 is suitable for the Dexter 3 D process (known on the market as the ABC chemical system). Bigger and customized units are also available (see our web site for COMPACTA L 400).
An even or no trace matte finish appeared by the abrasive spray is the best condition of the panel surface for the pre-treatment of D/F lamination, solder mask and liquid photo resist.
COMPACT MULTI LAYER SHEAR/BEVELER WITH OPTICAL ALIGNMENT SYSTEM.
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